Esec 3088 manual

GRDTech provides the Total Package Solution for your wire bonding needs. We support ALL ESEC wire bonder platforms including , , , , ip. We also provide service support on KS, MechEl, Westbond Manual Wire bonders. We also work closely with SPT tooling to .  · TAIPEI, Taiwan — ESEC S.A. today introduced a new wire bonder, the , at Semicon Taiwan ESEC claims the platform constitutes a new benchmark for the semiconductor industry in terms of chip package miniaturization, bond range, speed and precision. ESEC also claimed it developed the wire bonder in the record time of six www.doorway.ruted Reading Time: 2 mins. Automatic Wire Bonders ESEC Ball-Wedge Bonder Specifications Ultrasonic frequency: kHz Flying bondhead Fixed electrode (EFO currents upto mA) Bond placement accuracy: ± µm (3 sigma) Sprint UPH: 17 wires/second (UPH depends on material/ process requirements) Maximum bonding area: 52 mm x 70 mm (2" x ") Process zone temperature: ambient to °C Various.

Manual wafer mount: Die-Demounter: ESEC brand all series of welding and bonding Equipment and spare parts 、、、HS 、IP 、 Wire Bonders such as Wire Bonding, Manual Wedge Bonders, Automatic Ball Bonders, Automatic Wedge Bonders, Manual Ball Bonders from Used, Surplus, Refurbished Semiconductor Manufacturing Equipment, Parts, Accessories and Supplies For Sale, Auctioned and Wanted. GRDTech provides the Total Package Solution for your wire bonding needs. We support ALL ESEC wire bonder platforms including , , , , ip. We also provide service support on KS, MechEl, Westbond Manual Wire bonders. We also work closely with SPT tooling to fulfill your process requirements.

For metals with complex geometry, manual polishing requires extensive care during Thermosonic ball bonding is carried out on the ESEC wire bonder. 1 មករា / FK Delvotec ASM /Eagle 60/ESEC please read the Instruction manual carefully before using the product. Automatic Wire Bonders ESEC Ball-Wedge Bonder Specifications Ultrasonic frequency: kHz Flying A ESEC bal-wedge bonder. Manual Wire Bonders.